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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
! Caution/Notice
c Notice (Soldering and Mounting) PRF18/21 Series
1. Solder and Flux
R90E.pdf
Mar.4,2014
(1) Solder Paste
(a) Flow Soldering: Use Sn:Pb=60:40wt%,
Sn:Pb=63:37wt%, Sn:Ag:Cu=96.5:3.0:0.5wt% or
equivalent type of solder.
(b) Reflow Soldering: Use Sn:Pb=60:40wt%,
Sn:Pb=63:37wt%, Sn:Ag:Cu=96.5:3.0:0.5wt% or
equivalent type of solder paste.
For your reference, we are using "63Sn/37Pb
RMA9086 90-3-M18," manufactured by Alpha Metals
Japan Ltd., "96.5Sn/3.0Ag/0.5Cu
M705-GRN360-K2-V," manufactured by Senju Metal
Industry Co., Ltd. for any internal tests of this product.
2. Cleaning Conditions and Drying
To remove the flux after soldering, observe the following
points in order to avoid deterioration of the characteristics
or any change to the external electrodes' quality.
(1) Cleaning Conditions
(2) Flux
Use rosin type flux in the soldering process.
If the flux below is used, some problems might be
caused in the product characteristics and reliability.
Please do not use these types of flux.
0.2wt%).
(*Water-soluble flux can be defined as non-rosin type
flux including wash-type flux and non-wash-type flux.)
Solvent
2-propanol
Dipping Cleaning
Less than 5 minutes
at room temp.
or
Less than 2 minutes
at 40?C max.
Ultrasonic Cleaning
Less than 1 minute
20W/L Frequency
of several 10kHz
to 100kHz.
A sufficient cleaning should be applied to remove flux completely.
(2) Drying
After cleaning, promptly dry this product.
3. Soldering Conditions
In your mounting process, observe the following points in
order to avoid deterioration of the characteristics or
destruction of this product. The mounting quality of this
product may also be affected by the mounting conditions,
shown in the points below.
(1) Printing Conditions of Solder Paste
(a) Recommended thickness of solder paste printing
should be from 0.15 to 0.20mm.
(b) After soldering, the solder fillet should be a height
from 0.2 mm to the thickness of this product (see the
figure at right).
(c) Too much solder result in excessive mechanical
stress on this product. Such stress may cause
cracking or other mechanical damage. Also, it can
E
Electrode
Solder
T
Solder
0.2mm V T V E
destroy the electrical performance of this product.
Continued on the following page.
96
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